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FUJITSU MICROELECTRONICS DATA SHEET
DS04-29128-1Ea
Spread Spectrum Clock Generator
MB88153A MB88153A-100/101/110/111
DESCRIPTION
MB88153A is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with the internal modulator. It corresponds to both of the center spread which modulates input frequency as Middle Centered and down spread which modulates so as not to exceed input frequency.
FEATURE
* * * * * * * * * * Power down pin : 10 A (Typ-sample) consumption current at power down Input frequency : 16.6 MHz to 134 MHz Output frequency : 16.6 MHz to 134 MHz (One-fold input frequency) Modulation rate can select from 0.5%, 1.5% - 1.0% or - 3.0%. (For center spread / down spread.) Modulation clock output Duty : 40% to 60% Modulation clock Cycle-Cycle Jitter : Less than 100 ps Low current consumption by CMOS process : 4.0 mA (24 MHz : Typ-sample, no load) Power supply voltage : 3.3 V 0.3 V Operating temperature : - 40 C to +85 C Package : 8-pin SOP
Copyright(c)2007-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2007.6
MB88153A
PRODUCT LINEUP
MB88153A has four kinds of modulation rate and modulation type (center spread/down spread). Product Modulation rate Modulation type MB88153A-100 MB88153A-101 MB88153A-110 MB88153A-111 -1.0% -3.0% 0.5% 1.5% Down spread Center spread
PIN ASSIGNMENT
TOP VIEW
CKIN 1 VDD 2 VSS 3 CKOUT 4
8 XPD
MB88153A
7 FREQ0 6 FREQ1 5 ENS
FPT-8P-M02
PIN DESCRIPTION
Pin name CKIN VDD VSS CKOUT ENS FREQ1 FREQ0 XPD I/O I O I I I I Pin no. 1 2 3 4 5 6 7 8 Clock input pin Power supply voltage pin GND pin Modulated clock output pin "L" output at power down Modulation enable setting pin Frequency setting pin Frequency setting pin (with pull-up resistor) Power down pin (with pull-up resistor) Power down at "L" input Description
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MB88153A
I/O CIRCUIT TYPE
Pin Circuit type Remarks CMOS hysteresis input
CKIN, ENS, FREQ1
CMOS hysteresis input with pull-up resistor 50 k (Typ)
50 k
FREQ0
CMOS hysteresis input with 50 k + 800 k (Typ) pull-up resistors
50 k 800 k
Note : If "L" is input to XPD when the XPD function is selected, 50 k pull-up resistor is disconnected.
XPD
(Continued)
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MB88153A
(Continued) Pin
Circuit type
Remarks * CMOS output * "L" output at power down
CKOUT
4
MB88153A
HANDLING DEVICES
Preventing Latch-up A latch-up can occur if, on this device, (a) a voltage higher than VDD or a voltage lower than VSS is applied to an input or output pin or (b) a voltage higher than the rating is applied between VDD pin and VSS pin. The latch-up, if it occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use this device, be very careful not to exceed the maximum rating. Handling unused pins Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or pull-down resistor. Unused output pin should be opened. Power supply pins Please design connecting the power supply pin of this device by as low impedance as possible from the current supply source. We recommend connecting electrolytic capacitor (about 10 F) and the ceramic capacitor (about 0.01 F) in parallel between VSS pin and VDD pin near the device, as a bypass capacitor. Clock I/O circuit Noise near the CKIN pin may cause the device to malfunction. Design the printed circuit board so that the wiring for the clock input does not intersect any other wiring. Please pay attention so that an overshoot and an undershoot do not occur to an input clock of CKIN pin. Design the printed circuit board that surrounds the CKIN and CKOUT pins with ground.
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MB88153A
BLOCK DIAGRAM
VDD
2
Power down
XPD 8
Frequency setting
FREQ0 7
Frequency setting
FREQ1 6
PLL block
Modulation clock output
4 CKOUT
Modulation enable setting
ENS 5
Clock input
CKIN 1
3 VSS
1 - M
Phase compare Charge pump V/I conversion
Frequency setting
IDAC
ICO
Reference clock
1 - N
Modulation clock output
Loop filter Modulation rate setting/ Modulation enable setting
1 - L
Modulation logic
MB88153A PLL block A glitchless IDAC (current output D/A converter) provides precise modulation, thereby dramatically reducing EMI.
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MB88153A
PIN SETTING
When changing the pin setting, the stabilization wait time for the modulation clock required. The stabilization wait time for the modulation clock takes the maximum value of Lock-Up time in " ELECTRICAL CHARACTERISTICS * AC Characteristics". ENS modulation enable setting ENS L H Modulation No modulation Modulation
Note : Spectrum does not spread when "L" is set to ENS. The clock with low jitter can be obtained. FREQ0, FREQ1 frequency setting FREQ0 FREQ1 L L H H L H L H
Input frequency range 16.6 MHz to 40 MHz 66 MHz to 134 MHz 33 MHz to 67 MHz 40 MHz to 80 MHz
Note : It is set according to the frequency of the clock input to the device. Set FREQ0 pin to "H" for the pin opened because FREQ0 pin has pull-up resistor. XPD power down setting XPD L H
Power down Power down Normal operation
Note : When "L" is set to XPD pin, the power down operation is implemented and "L" is output to CKOUT pin. When "H" is input to XPD pin or XPD pin is opened, normal operation is implemented because the XPD pin has pull-up resistor.
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MB88153A
* Center spread Spectrum is spread (modulated) by centering on the input frequency.
3.0% modulation width Radiation level
-1.5%
+1.5%
Frequency Input frequency Center spread example of 1.5% modulation rate
* Down spread Spectrum is spread (modulated) below the input frequency.
3.0% modulation width Radiation level
-3.0%
Frequency Input frequency
Down spread example of - 3.0% modulation rate
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MB88153A
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage* Input voltage* Output voltage* Storage temperature Operation junction temperature Output current Overshoot Undershoot Symbol VDD VI VO TST TJ IO VIOVER VIUNDER Rating Min - 0.5 VSS - 0.5 VSS - 0.5 - 55 - 40 - 14 VSS - 1.0 (tUNDER 50 ns) Max + 4.0 VDD + 0.5 VDD + 0.5 + 125 + 125 + 14 VDD + 1.0 (tOVER 50 ns) Unit V V V C C mA V V
* : The parameter is based on VSS = 0.0 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Overshoot/Undershoot
tUNDER 50 ns VIOVER VDD + 1.0 V
VDD
Input pin
VSS
tOVER 50 ns
VIUNDER VSS - 1.0 V
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MB88153A
RECOMMENDED OPERATING CONDITIONS
(VSS = 0.0 V) Parameter Power supply voltage "H" level input voltage Symbol VDD VIH Pin VDD CKIN, ENS, FREQ0, FREQ1, XPD CKIN, ENS, FREQ0, FREQ1, XPD CKIN Conditions Value Min 3.0 VDD x 0.8 Typ 3.3 Max 3.6 VDD + 0.3 Unit V V
"L" level input voltage
VIL
16.6 MHz to 134 MHz
VSS
VDD x 0.2
V % C
Input clock duty cycle Operating temperature
tDCI Ta
40 - 40
50
60 + 85
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand.
Input clock duty cycle (tDCI = tb/ta)
ta tb CKIN 1.5 V
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MB88153A
ELECTRICAL CHARACTERISTICS
* DC Characteristics (Ta = - 40 C to + 85 C, VDD = 3.3 V 0.3 V, VSS = 0.0 V) Parameter Symbol VOH Output voltage VOL Output impedance ZO CKOUT Pin CKOUT Conditions "H" level output IOH = - 4 mA "L" level output IOL = 4 mA Value Min VDD - 0.5 VSS Typ 45 Max VDD 0.4 Unit V V
CKOUT 16.6 MHz to 134 MHz CKIN, ENS, Ta = + 25 C, FREQ0, VDD = VI = 0.0 V, FREQ1, f = 1 MHz XPD 16.6 MHz to 67 MHz CKOUT 67 MHz to 100 MHz 100 MHz to 134 MHz FREQ0 XPD VDD VDD
Input capacitance
CIN
16
pF
25 500
50 800 4.0 10
15 10 7 200 1200 6.0 k mA A pF
Load capacitance
CL RPUE RPUP ICC Ipd
Input Pull-up resistance Power supply current Power down current
VIL = 0.0 V No load capacitance at 24 MHz output Input clock stopping
* AC Characteristics (Ta = - 40 C to + 85 C, VDD = 3.3 V 0.3 V, VSS = 0.0 V) Parameter Input frequency Output frequency Output slew rate Output clock duty cycle Symbol fin fOUT SR tDCC Pin CKIN CKOUT CKOUT Conditions Load capacitance 15 pF 0.4 V to 2.4 V Value Min 16.6 16.6 0.4 40 Typ Max 134 134 4.0 60 Unit MHz MHz V/ns %
CKOUT 1.5 V FREQ[1 : 0] = (00)
fin/2640 fin/2280 fin/1920 (2640) (2280) (1920) fin/4400 fin/3800 fin/3200 (4400) (3800) (3200) fin/5280 fin/4560 fin/3840 (5280) (4560) (3840) fin/8800 fin/7600 fin/6400 (8800) (7600) (6400) (Continued) 11 kHz (clks)
Modulation frequency (Number of input clocks per modulation)
fMOD (nMOD)
FREQ[1 : 0] = (10) CKOUT FREQ[1 : 0] = (11) FREQ[1 : 0] = (01)
MB88153A
(Continued) (Ta = - 40 C to + 85 C, VDD = 3.3 V 0.3 V, VSS = 0.0 V) Symbol tLK Pin CKOUT Conditions 16.6 MHz to 80 MHz 80 MHz to 134 MHz Value Min Typ 2 3 Max 5 8 100 Unit ms
Parameter Lock-up time
Cycle-cycle jitter
tJC
No load capacitance, CKOUT Ta = + 25 C, VDD = 3.3 V
ps-rms
Note : The modulation clock stabilization wait time is required after the power is turned on, the IC recovers from power saving, or after FREQ (frequency range) or ENS (modulation ON/OFF) setting is changed. For the modulation clock stabilization wait time, assign the maximum value for lock-up time.

f (Output frequency)
Modulation wave form
t
fMOD (Min)
fMOD (Max)
Clock count nMOD (Max)
Clock count nMOD (Min)
t
MB88153A contains the modulation period to realize the efficient EMI reduction. The modulation period fMOD depends on the input frequency and changes between fMOD (Min) and fMOD (Max) . Furthermore, the average value of fMOD equals the typical value of the electrical characteristics.
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MB88153A
OUTPUT CLOCK DUTY CYCLE (tDCC = tb/ta)
ta tb 1.5 V CKOUT
INPUT FREQUENCY (fin = 1/tin)
tin
0.8 VDD CKIN
OUTPUT SLEW RATE (SR)
2.4 V
CKOUT tr
0.4 V tf
Note : SR = (2.4-0.4) /tr, SR = (2.4-0.4) /tf
CYCLE-CYCLE JITTER
CKOUT tn tn+1
Note : Cycle-cycle jitter is defined the difference between a certain cycle and immediately after (or, immediately before) .
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MB88153A
MODULATION WAVE FORM
* 1.5% modulation rate, Example of center spread CKOUT output frequency
+ 1.5 %
Frequency at modulation OFF Time
- 1.5 %
fMOD
* -1.0% modulation rate, Example of down spread CKOUT output frequency Frequency at modulation OFF Time
- 0.5 %
- 1.0 %
fMOD
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MB88153A
LOCK-UP TIME
3.0 V
VDD
External clock stabilization wait time
CKIN
XPD
VIH
Setting pin FREQ0, FREQ1, ENS
CKOUT
VIH
tLK (lock-up time )
If the XPD pin is fixed at the "H" level, the maximum time after the power is turned on until the set clock signal is output from CKOUT pin is (the stabilization wait time of input clock to CKIN pin) + (the lock-up time "tLK"). For the input clock stabilization time, check the characteristics of the resonator or oscillator used.
VDD
3.0 V
External clock stabilization wait time
CKIN
XPD
VIH
Setting pin FREQ0, FREQ1, ENS
CKOUT
VIH
tLK (lock-up time )
When XPD pin controls the power-down, stable clock is output from CKOUT pin after becoming XPD pin = "H" level (in the maximum after lock-Up time (tLK) ). (Continued)
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MB88153A
(Continued)
CKIN VIH XPD
ENS
VIH VIL
tLK (lock-up time ) tLK (lock-up time )
CKOUT
When ENS pin is controlled for enable modulation, it is necessary for the stably clock output from CKOUT pin to wait lock-up time (tLK) . Note : In the following cases, it is necessary for the stably clock output from CKOUT pin, to wait lock-up time (tLK) . - After releasing power-down - When you change other terminal settings Output frequency, output clock duty cycle, modulation frequency, and cycle-cycle jitter are not guaranteed until the output clock is stable. It is recommended to take procedure to release of reset after. lock-up time (tLK) on the device using the modulation clock or etc.
16
MB88153A
INTERCONNECTION CIRCUIT EXAMPLE
CKIN VDD
1 2 MB88153A 3
8 7 6 5
XPD FREQ0 FREQ1 ENS
C1 R1
+
VSS C2
4 CKOUT
C1 C2 R1
: Capacitor of 10 F or higher : Capacitor of approximately 0.01 F (connect a capacitor of good high frequency property (ex. laminated ceramic capacitor) to close to this device) : Impedance matching resistor for a circuit on a board
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MB88153A
SPECTRUM EXAMPLE CHARACTERISTICS
The condition of the examples of the characteristic is shown as follows: Input frequency = 20 MHz (Output frequency = 20 MHz), use for MB88153A-111. Power-supply voltage = 3.3 V, None load capacity. Modulation rate = 1.5% (center spread). Spectrum analyzer HP4396B is connected with CKOUT. The result of the measurement with RBW = 1 kHz (ATT use for -6 dB) .
CH B Spectrum
10 dB /REF 0 dBm
No modulation -8.86 dBm
Avg 4
1.5% modulation -26.54 dBm
RBW# 1 kHZ VBW 1 kHZ CENTER 20 MHZ
ATT 6 dB
SWP 2.505 s SPAN 4 MHZ
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MB88153A
ORDERING INFORMATION
Part number MB88153APNF-G-100-JNE1 MB88153APNF-G-101-JNE1 MB88153APNF-G-110-JNE1 MB88153APNF-G-111-JNE1 MB88153APNF-G-100-JNEFE1 MB88153APNF-G-101-JNEFE1 MB88153APNF-G-110-JNEFE1 MB88153APNF-G-111-JNEFE1 MB88153APNF-G-100-JNERE1 MB88153APNF-G-101-JNERE1 MB88153APNF-G-110-JNERE1 MB88153APNF-G-111-JNERE1 Modulation rate -1.0% -3.0% 0.5% 1.5% -1.0% -3.0% 0.5% 1.5% -1.0% -3.0% 0.5% 1.5% Modulation type Down spread Down spread Center spread Center spread Down spread Down spread Center spread Center spread Down spread Down spread Center spread Center spread 8-pin plastic SOP Emboss taping (FPT-8P-M02) (ER type) 8-pin plastic SOP Emboss taping (FPT-8P-M02) (EF type) 8-pin plastic SOP (FPT-8P-M02) Package Remarks
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MB88153A
PACKAGE DIMENSION
8-pin plastic SOP Lead pitch Package width x package length Lead shape Sealing method Mounting height Weight 1.27 mm 3.9 x 5.05 mm Gullwing Plastic mold 1.75 mm MAX 0.06 g
(FPT-8P-M02)
8-pin plastic SOP (FPT-8P-M02)
Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
+.010
*1 5.05 -0.20 .199 -.008
8
+0.25
0.22 -0.07 .009 -.003
5
+0.03 +.001
*2 3.900.30 6.000.40 (.154.012) (.236.016)
Details of "A" part 45 1.550.20 (Mounting height) (.061.008) 0.25(.010)
0.40(.016)
1 4
"A"
0~8
1.27(.050)
0.440.08 (.017.003)
0.13(.005)
M
0.500.20 (.020.008) 0.600.15 (.024.006)
0.150.10 (.006.004) (Stand off)
0.10(.004)
C
2002 FUJITSU LIMITED F08004S-c-4-7
Dimensions in mm (inches). Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/
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MB88153A
MEMO
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MB88153A
MEMO
22
MB88153A
MEMO
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FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited Strategic Business Development Dept.

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